Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Wave Soldering to ENIG Pads

Views: 3244

#51651

Wave Soldering to ENIG Pads | 4 September, 2007

We just got new boards in that have ENIG pads. In the past we had a problem with too much gold getting into the wave solder pot from large connectors getting tinned at the wave. Do we have to worry about too much gold getting into the pot with this kind of finish? We are still a tin/lead operation, and use Kester 186 Rosin Flux in a foam. Is there anything specific that we should look out for when soldering to ENIG covered pads? Thanks for the help.

Sue

reply »

#51655

Wave Soldering to ENIG Pads | 5 September, 2007

The gold needs to go into the solder so the solder can form a connection between the the component and the nickel under the gold. The gold will disperse into the solder. Most of it will remain in your solder pot after board processing. Assess the content of your solder pot through periodic chemical analysis. Most solder suppliers offer this analysis service. SPC the results of the analysis to monitor the condition of your solder pot.

reply »

#51668

Wave Soldering to ENIG Pads | 5 September, 2007

Thanks for the reply Dave. We send out a solder sample for analysis every 30 Wave Solder days. At this point I am not sure how many of these boards will be done in that time frame. Might to be a good idea to send the sample off sooner if a large quantity comes to Wave.

reply »

#51676

Wave Soldering to ENIG Pads | 6 September, 2007

Without understanding machine loading, we'd guess that your current "every 30 wave solder day" sampling schedule is fairly conservative. Consider approaches to better understand change in the analysis results.

reply »

reflow oven profiler