High Freq. RF grade ceramic filled PTFE PCB material| 25 May, 2007
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform differently in multilayer applications. Generally speaking, PTFE has a melting point of 620*F and withstands solder reflow and HASL processes. * Hand soldering requires care to insure the copper bond is not diminished. * 150*C 1-2 hour bake temperatures are common in processing. * Storage is typically not an issue with PTFE products. Insure that there is minimal moisture to prevent copper cladding from oxidizing. * Although PTFE and the ceramic filled hydrocarbon thermoset resin can be exposed to very high temperatures for prolonged periods of time, the copper cladding on the dielectric limits the temperature exposure of the laminate.