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SMT electronics assembly manufacturing forum.


SMT component handling

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#50166

SMT component handling | 10 May, 2007

Hello

I am looking for any standard or specification or any practise document which is talking about proper handling or how should handling look like of IC component at the section between getting component from supplier and putting it into machine.

Any good practise which is telling how should we storing component, transporting component to the machine what kind of protection method we should use to avoid damaging component from handling or operator mistakes. Im talking about component which is packed mainly in trays. Does anybody can help me? thanks in advance peter

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#50167

SMT component handling | 10 May, 2007

pEte,

Check out the arkives for this topics because we done have talked about his subject at different dates just on a different time form now. Common cents is another area that to be looking into when handling componets from going into you r buildinf to into your machines. Bending the legs is a no no two and you should be very careful about that as well or you can have alot of isues later in youre process.

Did you like DeVry? I'm thnking of goiing back for my Masters.

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#50168

SMT component handling | 10 May, 2007

We ve got storage next to factory. We use trolleys to transport material to SMT machine so hard to suspect bend leads during tansport. Anyway any good documents saying about this will be good to have.

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#50182

SMT component handling | 11 May, 2007

Larry

I checked archive but I didnt find any satisfaction answer. Maybe u can help me? Something telling what should operator do to avoid bend leads in IC components - I m talking about handling dangerous.

regards peter

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#50184

SMT component handling | 11 May, 2007

IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3 Handling Considerations 3-9 3.3.1 Guidelines 3-9 3.3.2 Physical Damage 3-10 3.3.3 Contamination 3-10 3.3.4 Electronic Assemblies 3-10 3.3.5 After Soldering 3-11 3.3.6 Gloves and Finger Cots 3-12

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#50193

SMT component handling | 11 May, 2007

i's wnts there

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