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IEC 60601-1 Humidity Failures - No Clean Flux

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IEC 60601-1 Humidity Failures - No Clean Flux | 7 May, 2007

IEC 60601-1 is a UL regulatory standard for Medical Electronic Equipment. We recently ran the humidity pre-conditioning segment of this testing and have found electromigration repeatably in areas with hand soldered joints (remaining NC flux). IEC 60601-1 requires a 95% non-condensing soak which is in a different class when compared to typical IPC and Bellcore testing criteria.

We have determined that the material we are using is not compatible with the application. The flux supplier we are working with has not tested their material to this standard and I doubt many, if any, other suppliers have either. Going to be checking this.

Does anyone have experience with IEC 60601-1 testing using a Lead Free No Clean process?

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