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ICT Question, Via holes and Probes

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Brett

#49360

ICT Question, Via holes and Probes | 27 April, 2007

For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder?

The ICT preson here insists that there be a "domed" fillet, and for those of you well versed in soldering mechanics, we all know that's hard to achieve all the time on 20,000+ via's, especially since it is just a hole, with no lead that helps wicking a fillet formation occur.

Isn't there a probe style for ICT that will accomodate a filled via - domed or not?? HELP!!!

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#49364

ICT Question, Via holes and Probes | 27 April, 2007

No dome needed. You should check what type probe you have. You can look here and consult with them:

http://www.qualmaxamerica.com/qualmax/leeno/semi.asp?string=ICT

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Brett

#49366

ICT Question, Via holes and Probes | 27 April, 2007

Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet?

The ICT personnel complains about this scenario too.

I'm not an ICT person, but I do know that there are pogo pins that have a crown (for the annular ring) and sharp probe combination.

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