Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


CSP and BGA soldering difference.

Views: 3198

Haris

#48804

CSP and BGA soldering difference. | 2 April, 2007

Dear all,

I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference).

Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elements, then can i use the same soldering profile for them.

Thanks

reply »

Guest

#48875

CSP and BGA soldering difference. | 4 April, 2007

Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results

reply »

Haris

#48883

CSP and BGA soldering difference. | 5 April, 2007

Still confused what you are trying to say? And I didnt get the answer regarding soldering profile.

reply »

#48886

CSP and BGA soldering difference. | 5 April, 2007

"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed.

If that's the case, you'd have to have flux-dip capabilities on your pick-and-place equipment, where the CSP bumps would get dipped in liquid/tacky flux, and then placed onto the board. The flux and your standard reflow profile that you'd use for any BGA will then reflow solder the bumps and all of the other devices on your board. Now...if there is a massive CTE mistmatch between your CSP and board, you'll have to underfill the CSP's after reflow soldering to give the device additional mechanical stability when it is thermally stressed.

.... "that's where the Engineering part of your job comes into play..." Determining to underfill or not to underfill....to screen print or flux dip... etc..etc..

reply »

Haris

#48908

CSP and BGA soldering difference. | 6 April, 2007

My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.

reply »

#48912

CSP and BGA soldering difference. | 6 April, 2007

Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type of information.

reply »

#48913

CSP and BGA soldering difference. | 6 April, 2007

UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more.

We have no relationship, nor receive benefit from the company referenced above.

DIP-FLUXING Dip fluxing is one approach to preparing solder balls for soldering. Other approaches are: * Solder paste * No flow-fluxing underfill encapsulant

reply »

#48915

CSP and BGA soldering difference. | 6 April, 2007

CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is <1.2X the size of the die being packaged.

reply »

Haris

#48924

CSP and BGA soldering difference. | 7 April, 2007

Thank you all for giving me good knowledge.

reply »

PCB Soldering Tools

SMT Custom Nozzles