100% on the lead pads and 50% reduction on the center pad if you do not use thermal vias. If you do use thermal vias, you may need to increase the amount of paste needed, but not by much. 50% will be a good start. After reflow the toe fillets may not occur as there is no plating on the end of the lead for most of these packages.
The key to this part is the center pad. Too much paste and the part floats. A 50% reduction will eliminate this. if you use the thermal vias, check them after reflow from the bottom. Too much paste and you can have an icicle that hangs thru the via. Just enough and you should see partial fill of the via with magnification.