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Stencil apertures for SOT639-2 package

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#47717

Stencil apertures for SOT639-2 package | 16 February, 2007

I am looking for recommendations for working with this package. We have ran some QFN20's but this one is a little smaller and lead-free. If anyone has experience with this, I welcome your comments. Thanks

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#47806

Stencil apertures for SOT639-2 package | 19 February, 2007

Mark,

Did you check with manufacturer datasheet?

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#47810

Stencil apertures for SOT639-2 package | 19 February, 2007

It's a nasty little part, but usuallu solders well. Now your inspectors will thing it's not soldered and try and touch it up, but generally, the exposed leads are not tinned, and will not toe fillet. If they know this up front they won't over heat it and damage it. Replacing this part via normal rework equipment isn't fun either, but do-able.

Stencil paste design for a non via hole ground is as follows, which works well:

http://www.nxp.com/acrobat_download/packages/footprint/FOOTPRINT-HBCC16-SOT639-2-REFLOW.pdf

I believe if your ground does have via perfs, this should work pretty well too.

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#47844

Stencil apertures for SOT639-2 package | 20 February, 2007

Thanks for the info. I will inform the QA department about the lack of a toe fillet. I am sure it will be an issue.

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