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A BGA reports (RoHS related of course)

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#47443

A BGA reports (RoHS related of course) | 9 February, 2007

Interesting BGA saga

http://www.emsnow.com/npps/story.cfm?ID=24434

To be continued

Patrick

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#47447

A BGA reports (RoHS related of course) | 9 February, 2007

Patrick, the suspense is killing me. What happens next?? I can't wait for the "conclusion."

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#47547

A BGA reports (RoHS related of course) | 12 February, 2007

:s I'd be frightened too if I had SAC305 in my balls.

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Wayne

#47548

A BGA reports (RoHS related of course) | 12 February, 2007

Most of the semi-con is using SAC305 balls. Only the PCB assembly house feels the heat, but semi-con never feels any pressure.

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#47619

A BGA reports (RoHS related of course) | 13 February, 2007

CK the Flip

#47625

A BGA reports (RoHS related of course) | 13 February, 2007

So the moral of the story is..... these SAC305 BGA's were accidentally mixed in with a Leaded process, the profile couldn't get hot enough due to Tg and Td constraints on a known good QFP on the same board, and consequently, the whole assembly failed in the field..

In addition to the not-hot-enough profile, the OSP board finish didn't help matters much either

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