Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Affect of Solder Mask on Heat Dissipation

Views: 5650

#47170

Affect of Solder Mask on Heat Dissipation | 2 February, 2007

For pads such as a d-pack... what is the effect on heat dissipation of leaving the unsoldered portion of the pad exposed metal or covering with solder mask? Is there a percentage of heat dissipation that is inhibited by covering with mask?

reply »

#47201

Affect of Solder Mask on Heat Dissipation | 5 February, 2007

Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal coating [AR, ER, UR]: 17-21 * Epoxy, silicone: 13-26 * Epoxy, conductive: 5 * Molding compound: 0.63 * FR4: 0.35 * Solder mask: 0.245 * BT resin: 0.17

reply »

reflow oven profiler

HeatShield Gel- thermal PCB shield during reflow