Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Baking Moisture Sensitive Components >4.5mm

Views: 1871

Colleen Miller

#46747

Baking Moisture Sensitive Components >4.5mm | 17 January, 2007

We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these components? Thanks,

reply »

#46818

Baking Moisture Sensitive Components >4.5mm | 18 January, 2007

Take this chance to update your documentation. See Appendix B in: http://www.jedec.org/DOWNLOAD/search/jstd033b.pdf

How much fun is that going to be? As an alternative, maybe your supplier can save you the pain.

reply »

#46881

Baking Moisture Sensitive Components >4.5mm | 22 January, 2007

Actually, I've been looking into this myself, and the B version doesn't help any more than the A version. The tables still only go to 4.5mm. And Appendix B has a bunch of formulas with undefined variables that I haven't been able to figure out. Anyone have some guidance on how to work this out, or some assumptions for the formulas?

reply »

#46888

Baking Moisture Sensitive Components >4.5mm | 22 January, 2007

Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2644 fmonette@cogiscan.com

Get back to us with the answer.

reply »

JTAG Live PCB Debug Software

SMT Custom Nozzles