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Where can i find Chip-on-board Forum?

Views: 1366

Setup Guy

#46529

Where can i find Chip-on-board Forum? | 8 January, 2007

Hi, My query is not related to SMT but i found you guys most helpful all the time.

Can someone point me to a Chip-on-board Forum?

Any response much appreciated.

Thanks.setup guy

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#46541

Where can i find Chip-on-board Forum? | 8 January, 2007

Let me know if you find one.

If you have a specific question, maybe I can help.

Chris

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#46545

Where can i find Chip-on-board Forum? | 8 January, 2007

Is having a specific COB forum a virtue or necessity? Is carving up this forum into various segments going to delute it in any way? We could start any forum segment that the community desires if interest is shown and would not delute this production forum. It seems to me if too many segments are started it would be more difficult to find items of interest. In the past we had more segments and people ended posting all questions to all segments. That is why we now have everything in one. Would a different title be better and should we change the name of the website to better reflect the broader manufacturing and design interests. SMTnet.com

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#46573

Where can i find Chip-on-board Forum? | 9 January, 2007

Setup Guy

Thanks for the compliment.

So, COB is not SMT. What is it? What kind of assembly areas do they use to print, place, reflow, and glob-top [or wire bond / encapsulate] COB? Any information you gave give to clairify this is appreciated.

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Guest

#46574

Where can i find Chip-on-board Forum? | 9 January, 2007

Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder technology. Bare die normally are placed using die bonder (ASM ,ESSEC). Some use thermosonic bonding to attach the die to the pad but the most common is by using silver conductive adhesive.

Normal COB process flow is : SMT - reflow - wash - Die Attach - adhesive cure( 150 C) - Wire Bond( K&S or Kaijo wirebonder) wire can be aluminum or Au - Glob top ( Camalot, Asymtek), epoxy - Cure- Singulation( if necessary)

COB process is commonly used for entry level products , consumer products and some consider it as old process. New approach now a days is flip chip and underfill.

I hope this would help, should you have other questions pls let us know.

Good luck.

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