Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Die temperature exceed Tg temperature

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#46266

Die temperature exceed Tg temperature | 19 December, 2006

Our company is assembly flip chip on flex, we have new design of flip chip which die temperature will increase until 145 degree C after test run the end product, however the Tg,glass transition temperature is 148. Will this case causing any reliabilty issue or any other issue will arise ?

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#46268

Die temperature exceed Tg temperature | 19 December, 2006

Take your choice: * Can't image this is a good thing. The board under the die will 'dry-out' and turn brittle over-time. It's possible the way attachment glue bonds to the board will change as the board dries-out. * Epoxy suppliers pad their numbers. So, there's maybe a 10% room to exceed the 148 Tg number.

We opt for the first choice.

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