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SMT PRODUCTION ISSUES

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CHITRA K

#45841

SMT PRODUCTION ISSUES | 1 December, 2006

We get both leaded components and lead free ( MIX OF COMPONENTS) components . In order to achieve good soldering results, please provide generic profile for reflow and wave soldering .

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#45842

SMT PRODUCTION ISSUES | 1 December, 2006

For reflow, bump up your profile as hot as you can go as allowed by your paste manufacturer will allow. If you can change solder paste without too much red tape, several solder paste manufacturers make a transitional paste designed for mix of lead and no-lead parts/boards.

For wave solder, you should be able to get by with your normal pot depending on your mix of thru-hole.

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#45845

SMT PRODUCTION ISSUES | 1 December, 2006

The best starting point for a thermal recipes are those provided by your reflow paste and wave flux suppliers.

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#46029

SMT PRODUCTION ISSUES | 6 December, 2006

The final reflow profile really depends on which of the components are Pb-Free (such as BGA's) and the lowest temperature limit of the components.

I'd be glad to share with you some ideas for solving your particular issue.

Please contact me offline.

Sincerely, Mario Scalzo, CSMTPE, Dartmouth 6 Sigma Green Belt Technical Support Engineer - Indium Corporation mscalzo@indium.com / 1-800-4-Indium

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