Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Baking of MSD devices

Views: 1474

#45744

Baking of MSD devices | 29 November, 2006

Hi! to all,

Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our criteria in baking the material. Now, after determining the body thickness of the BGA for example, what MSL level are we going to use to get the amount of time of baking? because on the table, there are 6 MSL levels to choose from, 2 ~ 5a.

Pls enlighten us on this..thanks

reply »

#45780

Baking of MSD devices | 29 November, 2006

According to J-STD-033B, 3.1 Requirements: The levels are determined per J-STD-020 and/or per JESD22-A113 plus reliability testing.

Look here: http://www.jedec.org/download/search/jstd020c.pdf

reply »

ii-feed SMT Intelligent Feeder

SMT Custom Nozzles