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via tenting and pluging

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shivam

#44855

via tenting and pluging | 3 November, 2006

HI ALL,

can anybody clear me what is via tenting and via pluging??

second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer pad???

clear me ppl

THANKS shivam

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#44859

via tenting and pluging | 3 November, 2006

Via filling methods are: * Tenting * Plugging * Capping * Flooding

Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering.

Plugged Via. An additional operation which is done independent of soldermask application. The via is filled with a non-conductive material.

Capped Via. An additional operation which is done independent of soldermask application on one or both sides of the via. The via is partially filled. When capping from both sides there may be issues with trapped air that expands during mass soldering.

Flooded Via. During soldermask application the via is flooded with soldermask. The via is partially filled. Chemical entrapment is a major concern.

Via Filling Recommendations Surface Finish||Tenting||Plugging||Capping||Flooding HASL||Okay||Okay||Okay||Okay OSP||Okay||Okay||Okay||Not recommended ENIG||Okay||Okay||Okay||Okay ImAg||Okay||Okay||Okay||Not recommended ImSn||Okay||Okay||Okay||Not recommended

["Substrate Topics", Rob Rowland, Process Engineering Manager, RadiSys Corporation, SMTA International, September 2003]

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