Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Ni/Pd/Au lead finish - reflow with SAC paste

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Eric Chen

#44632

Ni/Pd/Au lead finish - reflow with SAC paste | 20 October, 2006

I have tested several pastes on Ni/Pd/Au lead finsh at QFP but they showed high reject rate > 40% in wetting problem. I would like to know any specific reflow profile in order to acheive good wetting at this type of lead. Besides, any specific paste e.g. halide containing paste required

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