Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Qualification requirements for immersion tin finish

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Bob R.

#43662

Qualification requirements for immersion tin finish | 30 August, 2006

Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. Our requirements were written at a time when SnPb HASL was one of the few choices, but temp/humidity preconditioning doesn't seem appropriate for immersion tin. J-STD-003 even hints that it isn't appropriate for some finishes. HASL, OSP, and immersion silver do fine but immersion tin and, to a lesser degree, ENIG have trouble with solderability after this type of preconditioning.

Absent an industry standard method, what are other people using?

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#43670

Qualification requirements for immersion tin finish | 30 August, 2006

IPC-4554 - Specification for Immersion Tin Plating for Printed Circuit Boards

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