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BGA Solder Acceptance Criteria

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YQ Deng

#43580

BGA Solder Acceptance Criteria | 25 August, 2006

For FR4 ENIG PCB:

1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?

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#43590

BGA Solder Acceptance Criteria | 25 August, 2006

1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG.

2 Try IPC-7095 for acceptance critera for: * Void in ball * Missing Ball * Short ball / Bridging * Open ball * Popcorning

IPC-A-610 covers acceptance critera for voiding

So, what is this "CMK"?

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YQ Deng

#43674

BGA Solder Acceptance Criteria | 30 August, 2006

Dear Davef,

Sorry for late reply! CMK is a PCB supplier, BGA solder defect were found in CMK PCB.

is there other method to verify the BGA soler criteria, such as reliability test?

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#43676

BGA Solder Acceptance Criteria | 30 August, 2006

Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a mini-wave type solder tip. If there is plating contamination, the pads will not wet. a watersoluble flux will cut through any contamination, so be sure to use a no clean flux for this test.

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#43677

BGA Solder Acceptance Criteria | 30 August, 2006

Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a mini-wave type solder tip. If there is plating contamination, the pads will not wet. A water soluble flux will cut through any contamination, so be sure to use a no clean flux for this test.

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#43683

BGA Solder Acceptance Criteria | 31 August, 2006

IPC-SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

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