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Baking planars after new BGA placed.

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John N.

#43292

Baking planars after new BGA placed. | 14 August, 2006

Hi all, I work for a service company who do SMT repairs for a Blue Chip. The JEDEC standard doesn't seem to mention how long (if at all) you should bake a planar after placing a new BGA (after field failure). Any ideas? Thanks in advance. regards John

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GS

#43317

Baking planars after new BGA placed. | 14 August, 2006

Sure the bake need to be done after BGA replacement?

Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field.

Oven Temperature from 90 to 125�, it dependes from which kind of componente there are on boards. Some of them, cannot withstand at temperature higher then 105-115� (ie. electrolite capacitors, so the suggestion is to set the oven at 105�C (safe) How long ? It depends from size, thikness (qty of layers) and which kind of components ( any MSD ?) are placed on. It could be necessary from 24h to 72h, some time more. Thime can be lower if backing temperture of 125�C is allowed.

Best Regards....GS

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#43322

Baking planars after new BGA placed. | 14 August, 2006

JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices * ANSI/J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices

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John N

#43328

Baking planars after new BGA placed. | 15 August, 2006

Thanks guys.

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