Dealing with leadless chip carriers| 16 February, 2000
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a way we can size the stencil apertures or pads to form a convex hill of solder, or is there another technique we could employ?