Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Recycling components

Views: 825

Ofer Cohen

#43167

Recycling components | 3 August, 2006

I'd appreciate your support in the following issue:

A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT components with pitch of 0.5 mm or bigger).

We are considering recycling the components. The BGAs shall be removed and re-balled (using laser welding � a process I personally do not know). The process will be done by specialized company. The components are intended for SnPb soldering, and are for telecom products.

We take for granted that the reliability of the components will be affected (internal balls, wire bonds, package de-lamination, etc.). Some of the damage shall be identified in the screening tests and others will be found only in the field.

My questions:

1. Did you experience mass recycling of components?

2. Can the reduction of reliability be quantified? If possible � divided into complete failure, that will be identified during the production screening, and reliability reduction, that will be cause a field failure.

This message was posted Add this forum to your site! Click to learn more. the Electronics Forum @

reply »

Ofer Cohen

#43168

Recycling components | 3 August, 2006

I'd appreciate advise in the following issue:

A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT components with pitch of 0.5 mm or bigger).

Since the involved components are very expensive, we are considering recycling them. The BGAs shall be removed and re-balled (using laser welding � a process I personally do not know). The process will be done by specialized company. The components are intended for SnPb soldering, and are for telecom products.

We take for granted that the reliability of the components will be affected (internal balls, wire bonds, package de-lamination, etc.). Some of the damage shall be identified in the screening tests and others will be found only in the field.

My questions:

1. Did you experience mass recycling of components?

2. Can the reduction of reliability be quantified? If possible � divided into complete failure, that will be identified during the production screening, and reliability reduction, that will be cause a field failure.

This message was posted Add this forum to your site! Click to learn more. the Electronics Forum @

reply »

Polymeric Workmanship PCB for Training

ii-feed SMT Intelligent Feeder