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BGA Vs. QFP

Views: 2457

Bolos

#42409

BGA Vs. QFP | 25 June, 2006

anyone who can comment and win for me..I prefer a BGA but my designer needs to add 3 dollars for the boards ..how to beat this 3 dollars from manufacturing pooint of view?..with a 15K volume of boards..therefore i need to beat 45K$ ...hell[p[p[[[...

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RDR

#42433

BGA Vs. QFP | 26 June, 2006

Just don't see it happening Bolos, aint gonoing to make up 3 bucks with BGA vs. QFP. Both packages from an assembly standpoint should be equal dollars. Why do you want BGA over QFP? Is it because you think your process will be better with BGA?

Russ

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#42451

BGA Vs. QFP | 27 June, 2006

I don't understand why you think a BGA would be better than a QFP. Half the process questions I see on this forum seem to deal with BGA's, and the switch to Pbfree processing is a far greater hassle - Pb free QFP's will be compatible with either process. The debate still rages here monthly about using BGA's in mixed process. The main benefit of a BGA over a QFP is it uses less real estate. If the designer has the room to use a QFP, I say, let him do it.

A part we use in our facility used to come either in BGA or QFN. The manufacturer has discontinued all the BGA forms, and is only making the QFN for the next revision of the chip.

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#42477

BGA Vs. QFP | 28 June, 2006

BGA is better- in terms of 1.0 no bent leads or coplanarity problems 2.0 self align on solder pads 3. easy solder printing 4. large pitch ...I think those who goes for QFP have not had a strong SMT experience. Do not be hurt byt this is a basic SMT DFM rules...

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Loco

#42486

BGA Vs. QFP | 29 June, 2006

The first 3 points are process problems in your own plant. These should be solved anyway. 4th point isnt allways valid. 2 reasons pro qfp: -inspection and repair, do you have a good Xray system? Do you have a good BGA repair process? -it seems fine pitch components <=.65mm will become exempt from ROHS! Wohoo!

Hereby a call to all component manufactures: could you please make all your components fine pitch <=0,65 from now on, much appreciated!

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RDR

#42490

BGA Vs. QFP | 29 June, 2006

I agree that a BGA may be the better/easier process overall, but it is not 3 dollars per assy better, I am in agreement that you should be able to handle QFPS just as well as a BGA. PBfree BGAs do not self align BTW, so one needs to keep that in mind.

I look at it like this, some one with strong SMT experience would not be afraid of a QFP unless this part is a 12mil or finer pitch.

Russ

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#42684

BGA Vs. QFP | 12 July, 2006

Let's pretend there's no complication with RoHS, backward, foreward compatability - bla, bla, bla Vikings.

I would pick the BGA hands-down!

1.) The BGA Ball, the component's lead, IS the solder joint!

2.) No complanarity issues, bent leads, etc.

All's you need is a half-way-decent placement machine.

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#42686

BGA Vs. QFP | 12 July, 2006

From a design/test/troubleshooting perspective, I would pick a QFP hands down - I can't probe a hidden solder ball.

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RDR

#42689

BGA Vs. QFP | 12 July, 2006

i agree and I think we all do that the BGA is more robust in processing, BUT we forget that it is 3 dollars more per assy!!!!!!! It would take a very poor process to warrant 3 dollars per assy. If you can't place a QFP to this level (takes 3 dollars to rework every board off line)would you really want to mess with BGAs? it is obvious that this process cannot print or place. 3 Dollars is a lot of money!!!!

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