I have the situation where we may need to use a variety of reflow temperatures. It seems that the design engineers want us to try a variety of "unspecified" pastes on the products. For example, the first PCB would be assembled using a higher temperature paste. That can be sold seperately or it could be placed onto another small PCB which would be assembled using a lower temperature paste to avoid possible reflow problems with the first part. That product would go to to the end user who would need to use still a lower temperature paste in the assembly of their product such as Sn63Pb37. We are currently using both Sn63Pb37 and Sn96Au4 RMA pastes.
What are my options, and what are the various profiles. Is there a site where I can find most of this information.
1 Assess candidate solders by reviewing J-STD-006 (http://canfieldmetals.com/j-std006.htm) to determine solder formulations that have liquidous temperatures in the desired range. 2 Request recommended profiles from suppliers of the selected pastes. 3 Assess candidates.