This is indeed yet another proof that under impulse of the RoHS directives all norms are flushed down the drain. Bean counters are slowly but surely taking over our industry because they no longer face resistance by form of standards. Even the basic standards in engineering get jeopardized "you only change one parameter at the time" In the last couple of years alloys have changed, fluxes have changed, board plating has changed and now the diameter of the copper lead is going to change. High tin alloys desolve copper a lot faster compared to leaded alloys and knowing this we going to get thinner leads??? If s%6# hits the fan it will be very difficult to find the main cause with introducing all these variables all at the same time.
Are component manufactures reporting this to their customers? This will mean design change to have the proper lead to hole clearance.
Thanks Rob for keeping us updated about what's going on in the component-manufacturing world.