Voids in Au finished Cu in Pb-free laser soldering| 6 February, 2006
Hi, We are electrodepositing Au(0.25 to 0.5 microns) on Cu & using solder ball bonding process via laser.We are getting lots of voids within the solder (not kirkendall voids). Can anyone shed some light on this problem.We are not using any flux.Presence of moisture is also doubtful.