These are all good questions.
Dip fluxing is fine. Make sure you let all the remaining flux drip off the board. Letting it drip into the pot will cause a lot of spattering of hot solder � be careful. Dipping the board slowly into the pot should not push the parts up. The flux will work with you and start the capillary action, keeping your parts in place. The hard part is making sure the entire bottom side is submersed in the solder within about a 4 to 5 second time frame. Remove the board by picking up one end first. Do not remove the entire board at once.
Cleaning the board can be tricky depending on your board, cleaning process and also drying process. Not to mention environmental pitfalls. The concept to cleaning is to remove the flux. So the best way to do this depends on what you have available or what you can afford. Typically you need to spray the water onto the board to remove the flux from under the parts. Several small run companies use the dish washer type of machine lie EMC makes (http://www.bita.lu/emscreen.htm). Another thing to think of is water hardness. Softer water works better than hard water. Deionized water works better than soft water. Saponifiers or soaps can be used to help clean the boards too. The flux manufacturer can provide some help there. So depending on your product, water spots may or may not be acceptable.
You also have to consider the environmental aspect of cleaning boards too. Depending on your flux, you may not be able to simply let the flux wash down the drain. Do your homework here. You may want to think no-clean flux. I don�t believe there are any that allow you to "dip" the board into. Generally they require you to spray them, but I may be wrong, ask around.
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