Thermal cycling

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Hi all, If i know my field conditions and the required life... - Nov 04, 2005 by

There is no relationship between accelerated and actual life... - Nov 04, 2005 by davef

i though they had a accleration factor as a relationship bet... - Nov 04, 2005 by

Visit Proof Of Design at ... - Nov 04, 2005 by moonshine

I agree with Dave 100%, ATC will expose the board and compon... - Nov 04, 2005 by Patrick Bruneel

Amol

#37635

Thermal cycling | 4 November, 2005

Hi all, If i know my field conditions and the required lifespan of the final product, how can i decide what thermal cycle to use for ATC to qualify the product?? I have the JEDEC standards for min-max temps and dwells, but how do i translate them into actual field conditions??

any literature/knowhow out there to do this??

Amol

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davef

#37637

Thermal cycling | 4 November, 2005

There is no relationship between accelerated and actual life tests.

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Amol

#37645

Thermal cycling | 4 November, 2005

i though they had a accleration factor as a relationship between ATC and actual life cycles

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moonshine

#37647

Thermal cycling | 4 November, 2005

Visit Proof Of Design at http://www.moonmanondarkside.com for free information on this and many other subjects.

MoonMan

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Patrick Bruneel

#37649

Thermal cycling | 4 November, 2005

I agree with Dave 100%, ATC will expose the board and components weaknesses and potential design problems and/or the need for conformal coating. The life span can only be predicted and/or extended by well-documented field failure analyses history and implemented corrective actions. This is exactly why lead-free should not be used in hi-rel at this stage.

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