Hi All,
I would like help in establishing what is a feasible PPM reject rate from a typical SMD line.
As a reference an SMD line consists of, solder paste printer, chip component placement, pick and place IC components and reflow.
What is a benchmark standard, 100ppm, 50 or 20ppm ? typical rejects are; missing components, trayed components, tombstoning, non wetting, bridging, etc.
second part to the question is where is this PPM detected, is it at AOI or at visual inspection by operator.
Reason being, I am concerned to base all my PPM data from an AOI machine where it can give a false sense of security. A poorly programmed AOI can give high rejects, but this does not neccessarily mean that the placement and reflow is poor, mearly the AOI is rejecting good parts. And visa-verse
Cheers
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