SMT leadless component solderability finishes

Typically, Sn/Pb solders are used to preserve solderability on leaded and leadless SMT components. Are other finishes (such as those used in PCB manufacturing e.g. Sn, NiAu, OSP's, etc.) frowned upon by PCB stuffers and their customers? I am interested in using something other than tin/lead for solderability of copper electrodes on SMT leadless and leaded components. What are the drawbacks of the alternatives?

Any discussion would be greatly appreciated.

Thank You, Dennis Fall

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