BGA design Guidelines

Hi Edmund,

J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your assembly, check if the equipment can handle the necessary processes involved and check the archives to see what problems others encountered. To verify processes it is IMO highly recommended to assemble enough samples and have them checked sorrowly ( X-Ray and microsectioning ) to determine the appropriate process window.

M2C

Wolfgang

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