Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


GSM 1 Pushdown function.

Bored

#33545

GSM 1 Pushdown function. | 5 April, 2005

Hi, I have seen in the past programs on GSMs using a pushdown function so that the selected previously placed component can be pushed once again into the paste by one of the nozzles. I have tried using greater pressure on the placement but need that extra push into the paste. I thought I had seen this function available for selection in the placement list but cannot find it anywhere. Can anyone help me on this?

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JAX

#33548

GSM 1 Pushdown function. | 5 April, 2005

This is not a built in function, you have to trick the machine. 1. Determine what you want to use to play "whack-a-mole" Regular or Modified nozzle. Regular will most likely get damaged from multiple "whacks"

2. Teach the nozzle as a package.

3. Pick parts from an empty/imaginary feeder I suggest a very thin matrix, since it does not have power pogos it will not require you to actually have it in the machine.

4. Pick from the non-existant feeder and let the show begin.

Although not mentioned, don't forget : The machine needs to think that you are actually placing something..... This will require placement locations ( Ref. Des. )

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Bored

#33554

GSM 1 Pushdown function. | 5 April, 2005

Thanks Jax!

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#33577

GSM 1 Pushdown function. | 6 April, 2005

Keep in mind if you are trying to add more pressure on a standard head you must use the following increments: 150, 250, 350 and 450. If you use 175 it will automatically go to 150. There are only four settings on a standard head. On a C4 Head you may use 125 to 1000 grams (5% accurate). The pressure is based on encoder counts.

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