Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type) At ICT found major reject criteria was short nail. I did reconfirm short nail was and small solder bridginh in between epoxy & chip terminal by x-ray and remove the chip. Then I did check with curing profile, was proper cured @ 150 degree C, 1:52 minute. Any body had experience with this type of problem , please help me. Give me understanding, what happen and how to solve this type of problem. My assembly was very simple PCB FR4, double side with 0805 chip. Thank you, Wirat S.
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