Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

BGA vias

We are currently designing a multi-layer board using a BGA w... - Aug 28, 2004 by mes  

Choices are: * Via Pad / Drill = 0.020 / 0.010 (Inches) * ... - Aug 31, 2004 by davef  


mes

#30279

BGA vias | 28 August, 2004

We are currently designing a multi-layer board using a BGA with a pitch of 1mm. Need to find out what hole/pad size via and if they should be plated holes? Thanks

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davef

#30314

BGA vias | 31 August, 2004

Choices are: * Via Pad / Drill = 0.020 / 0.010 (Inches) * What ever the IPC land calculator says

reply »

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