Use of Lead Free components With NonLead Free Solder Paste

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We find that the component industry has migrated to lead fre... - Aug 09, 2004 by abraham

Abraham, Lead free components in a leaded process should ... - Aug 09, 2004 by

I have been seeing this with a new BGA we have just started ... - Dec 01, 2004 by jdumont

Hi, High temp solder balls don't collapse in current lead... - Dec 01, 2004 by

NEMI kicked off a project within the last month or so to loo... - Dec 03, 2004 by

abraham

#29946

Use of Lead Free components With NonLead Free Solder Paste | 9 August, 2004

We find that the component industry has migrated to lead free components whereas our process is still not leadfree. We receive components from suppliers of which some are lead free and others are not. We populate both types of components on the same board using non lead free solderpaste. Our soldering profile is Ramp and the temperature of five zones is set to 100,120,155,200 and 265 oC. The peak temperature acheived on the component is 215 + - 5 oC. This profile is the same profile we were using when the components were non leadfree. Please let us know whether this profile will affect the solderability of lead free components.

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C Lampron

#29947

Use of Lead Free components With NonLead Free Solder Paste | 9 August, 2004

Abraham,

Lead free components in a leaded process should not be a problem. The problem increases with leaded components in a lead free process. For the most part, the only difference that you will see is in BGA procesing. If a BGA is lead free, the liquidous temp of the balls will be higher than the liquidous temp of SN63/37 solder. What you will see is the lead solder adhearing to the uncollapsed balls of the BGA much like a column grid array. Other than that, the diffences should be very subtle.

Chris

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jdumont

#31538

Use of Lead Free components With NonLead Free Solder Paste | 1 December, 2004

I have been seeing this with a new BGA we have just started using from IBM. Is this a problem if the solder paste is wetted to the unreflowed BGA balls??? It passed our ESS testing with no problems....

TIA JD

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Grant

#31550

Use of Lead Free components With NonLead Free Solder Paste | 1 December, 2004

Hi,

High temp solder balls don't collapse in current lead based soldering, so lead free balls are similar, and don't collapse, but should still solder ok. They just look different. However I would like to know other peoples experience about reliability.

Regards,

Grant

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Bob R.

#31557

Use of Lead Free components With NonLead Free Solder Paste | 3 December, 2004

NEMI kicked off a project within the last month or so to look at this specific issue.

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