The following are questions my boss has ask me to send out to you folks. This is done in an effort to see "What does the rest of the world do?" [if such a world could possibly exists, in the first place]. If you would select any or all questions to respond to, we here on the other side of reality would be appreciative.
I have been tasked to do a little investigation on varistors on the bottom side of PC boards that pass through wave solder processes. We'r experiencing current leakage, and we believe it is due to the porosity of the component absorbing flux from the wave solder process ( as found by CSL). Our current corrective action is to use glue dams (a series of connected dots that would make it difficult for an electrical path to occur between the ends of the components) and a covering of latex mask to prevent the flux from reaching the component. Obviously this process is labor intensive and increases the manufacturing costs.
Are surface mount non-epoxy coated varistors placed on the bottom side of PC boards?
Are surface mount non-epoxy coated varistors placed on the bottom side of mixed technology PC boards that will pass through a wave solder process and be exposed to flux?
Do special processes exist to protect bottom side non-epoxy coated varistors from flux?
Does the amount of flux placed on a board have any impact on board operation / quality?
Do processes exist to measure the amount of flux placed on the bottom side of the board?
How much flux should be placed on the bottom side of boards? Are cleaning processes required when non-epoxy coated varistors are used on the bottom side of boards?
Are ultrasonic cleaning processes recommended to address bottom side non-epoxy coated varistors leakage issues?
Do you have any insight to non-epoxy coated varistor type manufacturability issues?
Do you recommend pursuing epoxy coated varistors for bottom side applications that would be exposed to flux?
Any feedback, or direction to a source would appreciated. thanks Ray.
Todd F. Orsini Manager, New Products Engineering
reply »