Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Push&Pull Test of Fine Pitch Components

Bryan Sheh

#25771

Push&Pull Test of Fine Pitch Components | 19 September, 2003

Dear all, Is there anyone who has the experience in conducting Push&Pull test for fine pitch components?i.e.SOIC,QFP. The customer clearly stated that,"every lead should be tested for selected components".but, you know that,the fine pitch,0.5 or 0.7mm etc. how could I deal with it?

your kindly inputs will be greatly appreciated. thanks in advance.

Bryan Sheh

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#25825

Push&Pull Test of Fine Pitch Components | 24 September, 2003

Sounds like an ideal method for damaging fragile solder connections, eh?

Is your customer paying extra for this 'inspection'?

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#25843

Push&Pull Test of Fine Pitch Components | 25 September, 2003

Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds mechanical strength). I would say this would roughly get you where you want to be. This would be the worst way (and most expensive) I can imagine to find lifted leads.

Then tell your customer they are idiots!!!!

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