Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
Through hole question - what methods can be used to obtain u... - Aug 05, 2003 by MGL
Hi matt- You describe the board but did not indicate the co... - Aug 05, 2003 by CAL
Hi, Have you tried increasing the vibration at the main ... - Aug 05, 2003 by Kris
Another variable is whether the ground pads have proper ther... - Aug 05, 2003 by CSIMFGENG
Try to mechanically force the solder up the holes if it is e... - Aug 05, 2003 by
Check the areas that are getting solder on the top side. If ... - Aug 05, 2003 by MikeF
more heat heat, more time in wave ... - Aug 05, 2003 by
Hi, One thing you might want to do has to deal with the v... - Aug 05, 2003 by Cardinal Circuit
Thanks to all who have responded. The boards we are waving a... - Aug 06, 2003 by MGL
Is it possible the solder hole(s) is too large and the solde... - Aug 07, 2003 by
We do allot of multi layer boards with heavy ground planes o... - Aug 07, 2003 by
Problem areas are always ground connections. 20 pin dips hav... - Aug 08, 2003 by MGL
what, no top side preheat? ... - Aug 08, 2003 by
Top and bottom preheat - topside temp 250 plus at times atte... - Aug 08, 2003 by MGL
Assuming you are working to IPC standards, are you working t... - Aug 11, 2003 by