Stencil Aperture Reduction - Need Feedback

Hi Guys,

Need your good advice about this for a 5 thou stencil thickness:

0603 pad is 50mil x 40mil 0805 pad is 75mil x 45mil 1206 pad is 70mil x 50mil

I want the above apertures to be in IPC STD Homeplate Design + an area reduction of 15%. Will there be a problem with my solder joint strength?

FP QFP pad is 12mil x 60mil

I want my FP apertures to be reduced by 10%. This should be a problem here as my aspect and area ratios are okay. And I'm more concern about the above chip components.

What do you think of the above? Okay or Not?

Thanks

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