Our company is putting a BGA/CSP package assembly line together. We have been studying different assembly houses reliability (short and long term) monitoring programs. I was wondering if some of you who use BGA's/CSP's for your MCM's and Hybrid's could give us a sampling of what types of reliability testing you would like to have done to your packages? Thanks for your input in advance!!!
Bob Hartmann Product Marketing Engineer Chip Supply, Inc.
reply »