Please help to clairify the problem. Are we talking: * A pre-reflow [placement] problem? * A post-reflow [solder wetting] problem?
Is the wetting issue that you mention related to the board or to the component? Please give us a little more detail on: * Reflow profile * Solder paste and flux * Board pad to solder stencil aperature relationship * Are you using the infineon, alpha, philips parts interchangeably? What is the connection of these suppliers with the issues you present?
We have talked about 0402 soldering issues previously here on SMTnet. The fine SMTnet Archives maybe a good starting point.
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