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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Thick film solder pins process

David

#21546

Thick film solder pins process | 13 September, 2002

Do you know what will be the best solder process for pins at the edge of the ceramic substrate?

Thanks

reply »

David

#21547

Thick film solder pins process | 13 September, 2002

Do you know what will be the best solder process for pins at the edge of the ceramic substrate?

Thanks

reply »

#21555

Thick film solder pins process | 15 September, 2002

A near eutechtic alloy [ie, 63/37, 62/36/2, etc] would be fine. People print, place, and reflow millions of cermaic capacitors with these alloys every day.

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#21558

Thick film solder pins process | 16 September, 2002

Do you mean, rows of pins at the edge of the substrate, making it a SIP/DIP component? This is achieved by attaching leadframes with dedicated technology, and is a typical high-volume application. If you confirm this is what you are looking for, there is a lot I can tell you about. Just reply and let me know.

Stefano

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David

#21560

Thick film solder pins process | 16 September, 2002

Stefano:

Yes I do. May you let me know more about the dedicated technology?

Regards

david

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