interesting, not at all what we were told so yes lot's of contradictions comming from them, I have to say personally I've not beein impressed with there technical service of late, are they getting complacent I ask?
it's strange they say it'll cause tombstoning, it's unusal for a paste manufactutrer to actual state that, I know I've seen it but generally you can trace it back to poor print set up or bad placement or in my last case to a poor board design for thermal stablility, not sure I agree with that, besides the 'flavour' or the paste would also have an effect if your runnign a 2% silver then you have more chance of a tombstone due to the better wetting and obviously the nert atmosphere would add to this. as for the solder balling, erm I can say with hand on heart never seen it (well not on a correctly set up product anyways) Like I said I've been running it for a good number of years both in N2 and air and had no problm=ems, certainly on boards with higher complexity, BGA, CSP we do it as standard plus you'll find that your flux residues aren't as hard so it pin test's better than when run in air although that's not too bad either. Guess it's down to you weighing up the cost of the N2 although in yoru case with your generator it shouldn't be too bad.
JohnW
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