Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
anyone experience to solve the non-wetting on Microleadframe... - May 16, 2002 by xzinxzin
First thing that comes to mind is that your �dip & look� tes... - May 17, 2002 by davef
*the other components are 0402 and SOIC 16, the solderabilit... - May 17, 2002 by xzinxzin
Copper teminations with no solderability protection on your ... - May 18, 2002 by davef
I using water-soluble solder paste, the solder paste recomme... - May 19, 2002 by xzinxzin
xzinxzin, de' process engineer, Hi mate, am just maki... - May 20, 2002 by ianchan
Oooo, sorry I was napping. You said, you used water washabl... - May 20, 2002 by davef
> *the other components are 0402 and SOIC 16, the > ... - May 21, 2002 by hayashi
*yes, I used water soluble solder paste (OMG-WS-300), the fl... - May 22, 2002 by xzinxzin
xzinxzin, de Process Engineer, Ah....HAH! bingo! go s... - May 22, 2002 by ianchan
Ah, the customer is always correct, again. And you are offi... - May 22, 2002 by davef
xzinxzin