Don�t kid yourself Sal, either: * Components were always falling off your board, but someone just noticed it ... OR * Something in your process HAS changed ... OR * Both
Voids are primarily process indicators. I won't comment on the cause of the voids, because there are too many possibilities to check.
There is no standard, IPC or otherwise, on voids -- nor should there be. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. The reliability of your product depends on the design, manufacturing processes and controls, and end-use environment.
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