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Date:
January 05, 2002 10:21 AM
Author:
Todd Murphy
Subject: BGA Solder joint appearance for the Motorola 860
Has anyone ever had any solder related problems with the Motorola 860 BGA? We are currently using the 860 on several of our products and some of the solder joints for the 860 look like crumpled aluminum foil when viewed with the Ersa Scope. Does anyone know what causes this? Examining the balls on the 860 prior to assembly you will see the same ball characteristics. Some of the balls are smooth and some appear like a container of "Jiffy Pop". Is this a concern or inherent to the ball composition for the 860?
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=18578)
Date:
January 14, 2002 08:33 PM
Author:
Dason C
Subject: BGA Solder joint appearance for the Motorola 860
Can we say the "Jiffy Pop" is same as void? Also, please provide the manufacturer location, Malaysia?
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=18648)
Date:
January 07, 2002 08:31 PM
Author:
davef
Subject: BGA Solder joint appearance for the Motorola 860
While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect.
WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance.
IS THIS A CONCERN? Dunno, but since you're asking the question, you should understand the cause better than you do today. Consider:
* Contacting a Motorola application type to discuss the problem.
* Thermocoupling, reflowing, and assessing both types of balls.
* Performing metallographic analysis on both types of balls.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=18588)
