Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750... - Nov 12, 2001 by emmanuel
One of the key elements you need to keep in mind......What "... - Nov 12, 2001 by CAL
Underfill is primarily used in flip chip, CSP attach applica... - Nov 12, 2001 by davef
Underfilling PBGA's will increase the PCB level solder joint... - Nov 15, 2001 by
Hey Terry. You make points that would be interesting to man... - Nov 15, 2001 by davef
Yes, i confirm you that the BGA i'm refering to are Motorola... - Nov 21, 2001 by emmanuel
emmanuel