Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

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We are currently investigating alternatives to HASL for ci... - Jan 19, 1998 by

John Haman Jr.

#16864

Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly. | 19 January, 1998

We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interested in your opinion of its performance. Thanks

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