Paste in hole

Hi all, I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info or experiencing with theses processes would greatly appreciated. Thanks, Rin

reply »

| | Hi all, | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info or experiencing with theses processes would greatly appreciated. | Thanks, | Rin Rin, Call Indium Corporation. 1 800 4 INDIUM is the number. Ask for a sales representative and ask he or she about solder preforms and about information regarding the proper finished hole sizes, stencil aperture and solder preforms needed to obtain adequate paste volume for the process. They can definitely help you out. Regards, Justin Medernach Flextronics Int'l PIC East

reply »

ETS (Energy Technology Systems) is a manufacturer of Solder Reflow and Curing Ovens for the Electronics Industry. We offer a specially configured oven designed for processing of Pin in Paste processes as well as double sided mix technology boards. I would be happy to provide you with information on this oven as well as our experiences with ETS customers already using this process. Contact Brian Stumm at ETS, 509-483-0900 or by e-mail at ets@eznet.com.

| | | | Hi all, | | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info or experiencing with theses processes would greatly appreciated. | | Thanks, | | Rin | Rin, | Call Indium Corporation. 1 800 4 INDIUM is the number. Ask for a sales representative and ask he or she about solder preforms and about information regarding the proper finished hole sizes, stencil aperture and solder preforms needed to obtain adequate paste volume for the process. They can definitely help you out. | Regards, | Justin Medernach | Flextronics Int'l | PIC East

reply »

| | Hi all, | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info or experiencing with theses processes would greatly appreciated. | Thanks, | Rin Rin, Contant Universal Instruments at www.uic.com, or call them direct at (607)779-4982 for more info on complete process informaation

reply »

You can do some reading-up from Circuit Assembly Sep 96 and Jun 97. The problem is that they tell you only the good things and seldom evaluate them critically. I will be interesting to see what you want to do with the metal fence! (I presume is it those PC card metal back plate) Can you share your progress?

reply »

If you want there is a video tape, CD ROM and report on the use of the technology available from my web site www.bobwillis.co.uk | | Hi all, | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info or experiencing with theses processes would greatly appreciated. | Thanks, | Rin

reply »