Thought I'd jump in as I helped develop materials for the FC game. Au/Pb - bumping - talk to Hughes Tuscon about this. They do it and will discuss the process. For Flip Chip Technology here in the States - contact Peter Elenius at Flip Chip Technology in Phoenix. For materials for use - adhesives, underfills, etc. the best contact is Dexter Hysol - call Lisa Ryan at their facility in the City of Industry, CA - If you want to discuss some of the things I had to deal with in attaching devices to all sorts of substrates, flex, FR4, ceramic, G10, etc. don't hesitate to call me at 215.741.1822 or email me. end of line | | Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip Chip machines for the last 15 years. You may remenber the cheap Casio watches from over a decade ago had a flip on flex, we made the assembly equipment. Right now we have 5 machines for FC attach going down to +/- 10 microns in placement accuracy or 6000 cph at 250 micron pitch bump(+/- 35 microns). The problem is lack of standardization. We will not sell machines in the US unless we can sell enough to make $$$, (I know it's a strange idea but thats the way we work) We have a show in Tokyo the 1st week of Dec. the CREATE SHOW where we show some of this technology, you should attend. So far we have worked with C4, ACF attach,conductive adhesives, and a Au/Pb attach that we developed that allows the underfil to go on first. (Underfil is the single biggest problem with FC attach). It is exciting but not ready for mainstream assembly I think, Thank god for CSP. Later... Captian America? | | | | Hi all, | | | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process terminology. Basically, I don't know the "how." If anyone can assist me or knows of someone I can call, please, let me know. I would greatly appreciate it. My direct phone number is 978 392 3218. Leave a message as I'm never at my desk. | | | | Thanks in advance. | | | | Gosh, I love this forum. | | | | Sincerely, | | | | Justin Medernach | | | | Flextronics Int'l | | | | PIC Westford, MA | | | Hey baby, | | | I would give you anything I know, but I am currently involved in advancing this technology to a new level. Give me a few months, or hire me to work with the Superboy, as Superman, and you can have the latest. | | | Actually, there is very little to the process except understanding the attachment process and the PCB substrate requirements. Then, it's all placement and bonding. | | | I'll keep you posted and give you the latest in this evolutionary (not breakthrough) process. Until then, I'm sure others will provide assistance. | | | Enjoy, | | | Earl Moon | | Jon, | Now I understand the relationship - father to son. | I thought it more of a sibling thing, but there | can be but one of each. | There is no Tokyo in my future, that I am aware, | but I too would appreciate any advice or advances | in the technology. The Au/Pb sounds interesting | but almost contradictory. | Yes, CSP should save us all. When will standardization | become a reality for FC? | Again, thanks for the input and any additional | you might provide, | Earl Moon
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Hi all,
I've received an interesting opportunity. I'm in...
- Jun 24, 1998
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